VIA and Rutronik Deepen IoT Collaboration
Taipei-based VIA is carving niches in the realm of Edge computing, leveraging its technological prowess to connect enterprises with the forefront of AI, IoT, and computer vision innovations. These advancements are ushering in a new era of efficiency and safety across diverse sectors including automotive, industrial, and building operations. VIA’s intricate global network serves as a conduit between major tech centres around the world, supporting a clientele that features several leading entities in technology, manufacturing, and transportation.
In a move that magnifies the synergy between leading Edge computing technologies and robust distribution networks, VIA has joined forces with Rutronik, a company renowned for its deep market penetration across Europe and a wide-reaching international footprint. Rutronik’s Senior Manager of Product Marketing for Boards & Storage, Anja Schaal, highlighted the significance of this partnership, expressing enthusiasm for integrating VIA’s groundbreaking solutions into Rutronik’s extensive portfolio. This collaboration not only promises to enhance Rutronik’s offerings but also enables access to a wide array of MediaTek’s design solutions, ranging from chip-level innovations to comprehensive system designs.
VIA is set on revolutionizing operational paradigms by melding state-of-the-art Edge AI, computer vision, and cloud technologies with durable systems and devices. According to Epan Wu, the General Manager at VIA Intelligent Solutions, Rutronik’s distribution prowess, rooted deeply in Europe yet expansive on a global scale, comes with an intrinsic understanding of the design-in process and comprehensive product lifecycle insights. This alliance is poised to significantly bolster VIA’s presence in European markets and beyond, capitalizing on Rutronik’s influential network and in-depth industry expertise.
At the heart of VIA’s Intelligent Edge Solutions lies the MediaTek Genio processor, powering an array of platforms engineered for a variety of applications. These include sophisticated human-machine interfaces, AI-enhanced computer vision, and future-ready smart Edge devices. VIA’s portfolio encompasses an expansive range of system-on-modules, single-board computers, and Edge AI systems tailored for diverse operational needs.
The hardware options provided by VIA are diverse, offering selections among SOM, Mini-ITX, and Pico-ITX form factors, all adhering to the highest standards of quality and designed for prolonged life cycles. The package is rounded off with support for Android and Linux through board support packages and software evaluation kits that streamline system development on Arm-based platforms. Moreover, VIA extends flexible hardware and software customisation services aimed at reducing development time and costs, thus providing a competitive edge for businesses seeking to invest in Edge computing technologies.
This partnership between VIA and Rutronik is more than just a business collaboration; it’s a fusion of technological innovation and market reach that promises to deliver comprehensive IoT solutions tailored to meet the current and future demands of the tech-forward enterprise.
